Tuesday, July 13, 2010

WEEK 3




We finished up in the clean room today. The mask etchings that we made last week in the clean room were used. First, we prepared our silicon wafer by pouring a chemical photoresist on it and spinning it in a machine. Then we baked it and placed it into another machine that contained the mask. Basically, the mask was imprinted into the wafer using Ultrviolet light. We then baked our wafer again and cleaned it in a developer that took off the photoresist and exposed our pattern from the mask. It was a very intense process and I was grateful to have had the chance to experience this.

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